|本期目录/Table of Contents|

[1]徐秉声,吴湖,韩琳,等.熔融Sn-3.0Ag-0.5Cu在倾斜铜基板上表面形貌的模拟[J].有色金属科学与工程,2014,(04):7-12.[doi:10.13264/j.cnki.ysjskx.2014.04.002]
 XU Bingsheng,WU Hu,et al.Simulation analysis on the surface morphology of Sn-3.0Ag-0.5Cu melting on the inclined Cu substrate[J].,2014,(04):7-12.[doi:10.13264/j.cnki.ysjskx.2014.04.002]
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熔融Sn-3.0Ag-0.5Cu在倾斜铜基板上表面形貌的模拟(/HTML)
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《有色金属科学与工程》[ISSN:1674-9669/CN:36-1311/TF]

卷:
期数:
2014年04期
页码:
7-12
栏目:
本刊特稿
出版日期:
2014-08-31

文章信息/Info

Title:
Simulation analysis on the surface morphology of Sn-3.0Ag-0.5Cu melting on the inclined Cu substrate
作者:
徐秉声12吴湖1韩琳1陈军伟1袁章福1
1. 北京大学工学院固体废弃物资源化技术与管理北京市重点实验室,北京 100871;2. 北京矿冶研究总院,北京 100160
Author(s):
XU Bingsheng1 2 WU Hu1 HAN Lin1 CHEN Junwei1 YUAN Zhangfu1
1.Beijing Key Laboratory for Solid Waste Utilization and Management, Department of Energy and Resources Engineering, College of Engineering, Peking University, Beijing 100871, China;2. Beijing General Research Institute of Mining & Metallurgy, Beijing 100160, China
关键词:
无铅焊锡表面形貌滞后性数值模拟
分类号:
TF125.2;TG457.13
DOI:
10.13264/j.cnki.ysjskx.2014.04.002
文献标志码:
A
摘要:
通过润湿性实验,借助有限元软件Surface Evolver模拟研究了在490 K温度下熔融态的无铅焊料Sn-3.0Ag-0.5Cu在倾斜铜基板上的铺展行为及界面特性.根据经验方程拟合熔滴侧面轮廓曲线并获得三相点处的接触角大小.经计算发现,在基板的倾斜角度较小时,三相接触线几乎不发生移动,三相接触线的后三相点沿基板向前移动,前三相点保持不动,相应地,前进角逐渐增大并达到最大值.随着基板倾斜角度的继续增大,前三相点开始向前移动,导致前进角逐渐减小,最终熔滴从基板上滑落.通过模拟铺展过程表征了接触角的滞后现象;通过SEM及EDS手段分析界面微观结构,说明了在润湿过程中发生了界面化学反应,确定了金属间化合物Cu6Sn5生成并呈扇贝形分布.

参考文献/References:

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备注/Memo

备注/Memo:
收稿日期:2014-05-04 基金项目:国家自然科学基金资助项目(51174008);中国科学院战略性先导科技专项-实践十号返回式科学实验卫星(XDA04020411, XDA04020202-11) 作者简介:徐秉声(1985- ),男,博士研究生,从事资源与能源工程方面的研究,E-mail: dengdaitianqingdeyu@126.com. 通信作者:袁章福(1963- ),男,教授,博导,从事资源与能源工程方面的研究,E-mail: zfyuan@pku.edu.cn.
更新日期/Last Update: 2014-08-30