|本期目录/Table of Contents|

[1]赵世强,郭丰.三价铬电沉积过程强化规律研究[J].有色金属科学与工程,2019,(04):11-15.
 ZHAO shiqiang,GUO feng.The regularity and process enhancement for Cr(III) electrodeposition[J].,2019,(04):11-15.
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三价铬电沉积过程强化规律研究(/HTML)
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《有色金属科学与工程》[ISSN:1674-9669/CN:36-1311/TF]

卷:
期数:
2019年04期
页码:
11-15
栏目:
出版日期:
2019-07-20

文章信息/Info

Title:
The regularity and process enhancement for Cr(III) electrodeposition
作者:
赵世强郭丰
(北京科技大学钢铁冶金国家重点实验室,北京100083)
Author(s):
ZHAO shiqiang GUO feng
(State Key Laboratory of Advanced Metallurgy, University of Science and Technology Beijing, Beijing 100083, PR China)
关键词:
三价铬电电沉积速率脉冲电镀镀液流动
分类号:
TF803
DOI:
-
文献标志码:
A
摘要:
铬镀层具有优异的机械和抗腐蚀性能,传统六价铬电镀存在高毒、高污染等问题,三价铬绿色电镀工艺受到普遍关注,但铬镀层不能持续增厚和镀液稳定性差是关键瓶颈。本文研究了脉冲电流和镀液流动对铬电沉积的影响规律,发现两者均可促进电镀过程中生成的副产物向镀液主体的传递。然而,脉冲电镀会降低铬电沉积效率,镀液流动可以提高铬电沉积效率,并能促进铬镀层的持续增厚。在50 ml min-1的镀液流动条件下,直流电镀60 min,可获得41 μm的厚铬镀层,沉积速率0.68 μm min -1,镀层表面平整致密。

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相似文献/References:

[1]赵世强,郭丰.三价铬电沉积过程强化规律研究[J].有色金属科学与工程,2019,(04):39.[doi:10.13264/j.cnki.ysjskx.2019.04.007]
 ZHAO Shiqiang,GUO Feng.The regularity and process enhancement for Cr (III) electrodeposition[J].,2019,(04):39.[doi:10.13264/j.cnki.ysjskx.2019.04.007]

备注/Memo

备注/Memo:
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更新日期/Last Update: 2019-06-26